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Submissions from 2017

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AC line connector with intermediate DC link, Juan Carlos Balda and Andrés Escobar-Mejía

Submissions from 2015

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Ultra-large grain polycrystalline semiconductors through top-down aluminum induced crystallization (TAIC), Douglas A. Hutchings, Seth D. Shumate, and Hameed A. Naseem

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Multi-threshold sleep convention logic without nsleep, Scott C. Smith and Jia Di

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Single component sleep-convention logic (SCL) modules, Scott C. Smith, Jia Di, Jerry Frenkil, Aaron Arthurs, and Ron B. Foster

Submissions from 2014

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Ultra-low power multi-threshold asynchronous circuit design, Jia Di and Scott C. Smith

Submissions from 2013

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Method for modeling and parameter extraction of LDMOS devices, Avinash S. Kashyap and H. Alan Mantooth

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High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device, Takukazu Otsuka, Keiji Okumura, and Brian L. Rowden

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Wireless nanotechnology based system for diagnosis of neurological and physiological disorders, Vijay K. Varadan

Submissions from 2012

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Ultra-low power multi-threshold asynchronous circuit design, Jia Di and Scott C. Smith

Submissions from 2011

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Ultra-low power multi-threshold asynchronous circuit design, Jia Di and Scott C. Smith

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Fabrication of large grain polycrystalline silicon film by nano aluminum-induced crystallization of amorphous silicon, Min Zou, Li Cai, and William D. Brown

Submissions from 2010

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Fabrication of large grain polycrystalline silicon film by nano aluminum-induced crystallization of amorphous silicon, Min Zou, Li Cai, and William D. Brown

Submissions from 2009

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Nanoparticle compositions, coatings and articles made therefrom, methods of making and using said compositions, coatings and articles, Ajay P. Malshe, Wenping Jiang, and William D. Brown

Submissions from 2008

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Microfluidic device utilizing magnetohydrodynamics and method for fabrication thereof, Eyitayo S. O. Fakunle, Prabhu U. Arumugam, Ingrid Fritsch, Jeffrey Elbert Mincy, Fred D. Barlow III, and Gangqiang Wang

Submissions from 2007

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Low temperature production of large-grain polycrystalline semiconductors, Hameed A. Naseem and Marwan Albarghouti

Submissions from 2006

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Passivation of material using ultra-fast pulsed laser, Tarak A. Railkar, Ajay P. Malshe, and William D. Brown

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Method of packaging RF MEMS, Leonard W. Schaper, Ajay P. Malshe, and Chad O'Neal

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RC terminator and production method therefor, Leonard W. Schaper and James P. Parkerson

Submissions from 2005

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Method of doping silicon, metal doped silicon, method of making solar cells, and solar cells, Hameed A. Naseem, M. Shahidul Haque, and William D. Brown

Submissions from 2004

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Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems, Leonard W. Schaper

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Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods, Leonard W. Schaper

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Surface applied passives, Leonard W. Schaper

Submissions from 2003

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Methods of making and using cubic boron nitride composition, coating and articles made therefrom, Ajay P. Malshe, Sharad N. Yedave, William D. Brown, William C. Russell, and Deepak G. Bhat

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Method of doping silicon, metal doped silicon, method of making solar cells, and solar cells, Hameed A. Naseem, M. Shahidul Haque, and William D. Brown

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Method of making capacitor with extremely wide band low impedance, Leonard W. Schaper

Submissions from 2002

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Method of doping silicon, metal doped silicon, method of making solar cells, and solar cells, Hameed A. Naseem, M. Shahidul Haque, and William D. Brown

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Conversion of electrical energy from one form to another, and its management through multichip module structures, Kraig J. Olejniczak, Keith C. Burgers, Simon S. Ang, and Errol V. Porter

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Electronic interconnection medium having offset electrical mesh plane, Leonard W. Schaper

Submissions from 2001

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Process for sequential multi-beam laser processing of materials, Ajay P. Malshe, Arzu M. Ozkan, and William D. Brown

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Electronic interconnection medium having offset electrical mesh plane, Leonard W. Schaper

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Floating plate capacitor with extremely wide band low impedance, Leonard W. Schaper

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Multichip module and method of forming same, Leonard W. Schaper

Submissions from 2000

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Floating plate capacitor with extremely wide band low impedance, Leonard W. Schaper

Submissions from 1999

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Method of electroplating a substrate, and products made thereby, John H. Glezen, Hameed A. Naseem, William D. Brown, Leonard W. Schaper, and Ajay P. Malshe

Submissions from 1998

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Apparatus for and method of polishing and planarizing polycrystalline diamonds, and polished and planarized polycrystalline diamonds and products made therefrom, Ajay P. Malshe, Hameed A. Naseem, and William D. Brown

Submissions from 1996

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Apparatus and/or method for recognizing printed data in an image, J. E. Bass and Dwight F. Mix

Submissions from 1995

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Method of planarizing polycrystalline diamonds, planarized polycrystalline diamonds and products made therefrom, Ajay P. Malshe, William D. Brown, Hameed A. Naseem, and Leonard W. Schaper

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Multichip module and method of fabrication therefor, Leonard W. Schaper

Submissions from 1993

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Silicon nitride for application as the gate dielectric in MOS devices, William D. Brown and Muhammad A. Khaliq

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Process for making superconducting wires, Allen M. Hermann, Zhengzhi Sheng, and Qamar A. Shams

Submissions from 1992

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Hybrid digital-analog computer parallel processor, J. E. Bass and Randy L. Brown

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Preparation of a superconducting Tl2Ca2Ba2Cu3Ox thick film by processing a rolled Ca-Ba-Cu-O film in Tl2O3 vapor, Qamar A. Shams, Allen M. Hermann, and Zhengzhi Sheng

Submissions from 1990

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Annealing process to stabilize PECVD silicon nitride for application as the gate dielectric in MOS devices, William D. Brown and Muhammad A. Khaliq