Date of Graduation

12-2011

Document Type

Thesis

Degree Name

Master of Science in Electrical Engineering (MSEE)

Degree Level

Graduate

Department

Electrical Engineering

Advisor

H. A. Mantooth

Committee Member

Juan Balda

Second Committee Member

Roy McCann

Abstract

A new physics-based IGBT compact model has been developed for circuit simulation of silicon (Si) or silicon carbide (SiC) devices. The model accurately predicts the steady-state output, transfer and switching characteristics of the IGBT under a variety of different conditions. This is the first IGBT model to predict the behavior of p-channel SiC IGBTs. Previous work on IGBT models has focused on Si n-channel IGBTs [1-3]. This unified model is not limited to SiC p-channel IGBTs; the user has the option to select between Si or SiC, and n-channel or p-channel, making it the first IGBT model that captures the physics of all of these device and material types. The model also accounts for temperature effects, often referred to as temperature scaling, that have been experimentally validated up to 300 ºC for SiC. Validation of n-channel and p-channel devices was accomplished by fitting the steady-state characteristics and inductive load switching transient waveforms. 15-kV p-channel IGBTs supplied by Cree were among those used for validation [6]. The fitting was achieved using Certify, a software tool developed at the University of Arkansas. A parameter extraction recipe for the model was developed for simple parameter extraction using data that are readily available from datasheets. That fitting tool is available to the public through the National Center for Reliable Electric Power Transmission website (ncrept.eleg.uark.edu). The model and parameter extraction recipe will also be made available to the public through NCREPT

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