Document Type

Patent

Publication Date

2-28-2006

Abstract

A thin-film RC circuit element suitable for a transmission line termination circuit is prepared by a process where (1) a first metal layer of an anodizable metal is deposited on a substrate, (2) the exposed surface of the anodizable metal layer is anodized to produce an oxide layer, (3) a second metal layer of electrically conductive metal is provided on the oxide layer, and (4) the first metal layer is etched to form an electrically resistive conductive path electrically connected to the region of the first metal layer beneath the second metal layer. A thin-film RC circuit element is also provided having a first layer of an anodizable metal formed on an electrically insulating substrate so as to provide two capacitor plates connected by a resistive strip, an oxide layer formed on the capacitor plates, and upper capacitor plates positioned on the oxide layer in register with the lower capacitor plates.

Department

Computer Science and Computer Engineering; Electrical Engineering

Patent Number

US7005722

Application Number

US20030057518

Application Published

3-27-2003

Application Filed

1-26-2001

Assignee

Board of Trustees of the University of Arkansas (Fayetteville, AR)

Comments

Leonard W. Schaper, Department of Electrical Engineering; James P. Parkerson, Department of Computer Science and Computer Engineering

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