Document Type

Patent

Publication Date

3-16-2004

Abstract

Describes surface applied passive devices for use on electronic circuit boards that are formed by applying layers of conductive, insulating, and other material to a thin polymer film carrier. The surface applied passives are thin enough to fit underneath standard integrated circuit packages in order to conserve space on the circuit board. Resistors, capacitors, inductors and other passive circuits may be formed on thin polymer films, less than 8 mils thick. This significantly aids in conserving space on an electronic circuit board.

Department

Electrical Engineering

Patent Number

US6707680

Application Number

US20020131254

Application Published

9-19-2002

Application Filed

3-5-2002

Assignee

Board of Trustees of the University of Arkansas (Little Rock, AR)

Comments

Leonard W. Schaper, Department of Electrical Engineering

Share

COinS