Document Type

Patent

Publication Date

1-2-2001

Abstract

A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.

Department

Biological and Agricultural Engineering; Electrical Engineering; Mechanical Engineering

Patent Number

US6168744

Application Filed

10-8-1997

Assignee

Board of Trustees University of Arkansas (Little Rock, AR)

Comments

Ajay P. Malshe, Department of Mechanical Engineering; Arzu M. Ozkan, Department of Biological and Agricultural Engineering; William D. Brown, Department of Electrical Engineering

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