A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.
Biological and Agricultural Engineering; Electrical Engineering; Mechanical Engineering
Board of Trustees University of Arkansas (Little Rock, AR)
Malshe, Ajay P.; Ozkan, Arzu M.; and Brown, William D., "Process for sequential multi-beam laser processing of materials" (2001). Patents Granted. 174.