Document Type

Patent

Publication Date

2-23-1999

Abstract

Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.

Department

Electrical Engineering; Mechanical Engineering

Patent Number

US5873992

Application Filed

3-24-1997

Assignee

Board of Trustees of the University of Arkansas (Little Rock, AR)

Comments

John H. Glezen, Department of Electrical Engineering; Hameed A. Naseem, Department of Electrical Engineering; William D. Brown, Department of Electrical Engineering; Leonard W. Schaper, Department of Electrical Engineering; Ajay P. Malshe, Department of Mechanical Engineering

Share

COinS