Document Type

Patent

Publication Date

12-5-1995

Abstract

A method of planarizing a diamond film which generally includes orifices in the surface is described. The method includes first polishing the diamond film surface to reduce the surface roughness. A filler material is applied to the surface of the film to fill the orifices in the film. The film is polished to remove excess filler material and expose the diamond film surface. Also disclosed are planarized diamond films diamond substrate having a polished surface of both diamond and filler material and a variation in thickness of less than 8 percent.

Department

Electrical Engineering; Mechanical Engineering

Patent Number

US5472370

Application Filed

7-29-1994

Assignee

University of Arkansas (Little Rock, AR)

Comments

Ajay P. Malshe, Department of Mechanical Engineering; William D. Brown, Department of Electrical Engineering; Hameed A. Naseem, Department of Electrical Engineering; Leonard W. Schaper, Department of Electrical Engineering

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