Document Type

Patent

Publication Date

3-1-2011

Abstract

A device having the capability for electrical, thermal, optical, and fluidic interconnections to various layers is described. Through-substrate vias in the interconnect device are filled to enable electrical and thermal connection or optionally hermetically sealed relative to other surfaces to enable fluidic or optical connection. Optionally, optical components may be placed within the region in order to manipulate optical signals. Redistribution of electrical interconnection is accomplished on both top and bottom surfaces of the substrate of the interconnect chip.

Department

Mechanical Engineering

Patent Number

US7897503

Application Number

US20090212407

Application Published

8-27-2009

Application Filed

5-12-2006

Assignee

Board of Trustees of the University of Arkansas (Little Rock, AR)

Comments

Ajay P. Malshe, Department of Mechanical Engineering; Matthew W. Kelley, Department of Mechanical Engineering

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