Document Type

Patent

Publication Date

3-30-2010

Abstract

One aspect of the invention relates to a method for fabricating a polycrystalline silicon film. In one embodiment, it includes the steps of providing a substrate having a thermally-grown silicon dioxide layer, forming an amorphous silicon film on the thermally-grown silicon dioxide layer of the substrate, forming an aluminum layer on the amorphous silicon film to form a structure having the substrate, the amorphous silicon film and the aluminum layer, and annealing the structure at an annealing temperature for a period of time in an N2 environment with a ramp-up time to crystallize the amorphous silicon film to form a polycrystalline silicon film.

Department

Electrical Engineering; Mechanical Engineering

Patent Number

US7687334

Application Number

US20070224788

Application Published

9-27-2007

Application Filed

3-23-2007

Assignee

Board of Trustees of the University of Arkansas (Little Rock, AR)

Comments

Min Zou, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR
Li Cai, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
William D. Brown, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR

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