Date of Graduation

5-2021

Document Type

Thesis

Degree Name

Bachelor of Science in Electrical Engineering

Degree Level

Undergraduate

Department

Electrical Engineering

Advisor/Mentor

Chen, Zhong

Abstract

When looking to the future of electronics, one characteristic is becoming more lucrative: high temperature capabilities. With the goals of not only becoming more efficient electronically, spatially, and cost-wise, adapting electronics for a high temperature environment can potentially be a route to all three of these goals. Not only does it take away the need for a cooling method, but it can also increase the longevity of a product which can make it even more cost effective. In an effort to contribute to the push for high temperature electronics, the University of Arkansas is developing a high temperature power module for use in various extreme environments. This includes the design of a two-stage transimpedance amplifier (TIA) to take input from an optocoupler and convert it to a useable gate drive signal for amplification. The tradeoffs in creating a TIA must be considered: gain and bandwidth, where a larger bandwidth results in less gain and also becomes more complex as more stages are added. Adding a second stage may increase the speed and gain of the amplifier, but this must also be evaluated with the increase in complexity in cost. So long as the cost is not so much more benefits the entire system as a whole, producing a clean gate drive signal for use at room temperature, it may be beneficial to employ this second stage. This can be adapted into high temperature circuitry for integration into the power module and with additional research, supply the signal required at temperatures up to 250 C.

Keywords

optocoupler, high temperature, TIA, transimpedance, photodiode, second order TIA

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