Date of Graduation


Document Type


Degree Name

Doctor of Philosophy in Engineering (PhD)

Degree Level



Electrical Engineering


Roy McCann

Committee Member

Fang Luo

Second Committee Member

David Huitink

Third Committee Member

Juan Balda

Fourth Committee Member

Zhong Chen


Converter design, Hybrid switch concept, More Electric Aircraft, Motor Drive, Power converters, Power Electronics


More-electric aircraft (MEA) is an attractive concept as it can reduce carbon dioxide emission, relieve fossil-fuel consumption, improve the overall efficiency of aircraft, and reduce the operational costs. However, it poses substantial challenges in designing a high-performance motor drive system for such applications. In the report of Aircraft Technology Roadmap to 2050, the propulsion converter is required to be ultra-high efficiency, high power density, and high reliability. Though the wide band-gap devices, such as the Silicon-carbide based Metal Oxide Silicon Field Effect (SiC-MOSFET), shows better switching performance and improved high-temperature performance compared to the silicon counterparts, applying it to the MEA-related application is still challenging. The high switching speed of SiC-MOSFET reduces switching loss and enables the design of high-density converters. However, it poses intense challenges in limiting the stray inductance in the power stage. The fast switching behavior of SiC-MOSFET also challenges the design scalability by multi-chip parallel, which is essential in high-power-rating converters. Moreover, the partial discharge can happen at the lower voltage when the converter is operated at high altitude, low air-pressure conditions, which threatens the converter lifetime by the accelerated aging of the insulation system. This dissertation addresses these issues at the paper-design level, power-module level, and converter level, respectively. At the paper-design level, the proposed model-based design and optimization enables shoulder-by-shoulder performance comparison between different candidate topology and then generates optimal semiconductor design space for the selected topology. At the power-module level, this dissertation focuses on the development of an ultra-low inductance module by using a novel packaging structure that integrates the printed circuit board (PCB) with direct-bounding copper (DBC). The detailed power-loop optimization, thermal analysis, and fabrication guidance are discussed to demonstrate its performance and manufacturability. At the converter level, this dissertation provides a comprehensive design strategy to improve the performance of the laminated busbar. In the design of the busbar conduction layer, this work analyzed the impacts of each stray inductance item and then proposed a novel double-side decoupled conduction-layer structure with minimized stray inductance and improved dynamic current sharing. In the design of the insulation system of the busbar, this dissertation investigates the design strategy to ensure the busbar is free of partial discharge without sacrificing the parasitic control. Through the dissertation, a single-phase 150 kVA converter, a three-phase 450 kVA converter, and a 1.2 kV, 300 A power module are designed, fabricated, and tested to demonstrate the proposed design strategies.