Describes surface applied passive devices for use on electronic circuit boards that are formed by applying layers of conductive, insulating, and other material to a thin polymer film carrier. The surface applied passives are thin enough to fit underneath standard integrated circuit packages in order to conserve space on the circuit board. Resistors, capacitors, inductors and other passive circuits may be formed on thin polymer films, less than 8 mils thick. This significantly aids in conserving space on an electronic circuit board.
Board of Trustees of the University of Arkansas (Little Rock, AR)
Schaper, Leonard W., "Surface applied passives" (2004). Patents Granted. 142.