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Abstract

In the application of high-temperature superconductors (HTSCs) in multi-chip module (MCM) technology, it is first necessary to investigate the advantages and disadvantages of the various HTSC compounds. The standard criteria for comparing the suitability of HTSCs in electronics applications has been critical temperature (Tc )and critical current density (Jc ). It is also necessary to consider the physical properties of HTSCs in relation to the various processing techniques required in fabrication of MCMs. These techniques can be grouped into four main areas: deposition, patterning, packaging, and characterization. The four main HTSC materials, Y-Ba-Cu-O, Bi-Sr-Ca-Cu-O, Tl,Ba-Ca-Cu-O and Hg-Ba-Ca-Cu-O, will be compared to determine which is most suitable for MCM application.

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