Date of Graduation
Master of Science in Electrical Engineering (MSEE)
Juan C. Balda
Fred D. Barlow III
Second Committee Member
The thermal demands of modern day electronic systems require innovative thermal solutions. Spray cooling has proven to be able to cool heat fluxes orders of magnitude higher than traditional cooling methodologies. This work includes a comparison of spray cooling to standard thermal management methodologies. Key system parameters and considerations are discussed. The properties of available packaging materials and their effect on the reliability of a spray cooled system are presented. Parameters such as fluid temperature, droplet size, fluid velocity and flow rate all directly impact performance and are detailed in this work. Finally, results from of a wide range of spray cooling experiments are presented and analyzed.
Junghans, Jeremy Scott, "Development of Spray Cooling for High Heat Flux Electronics" (2011). Theses and Dissertations. 169.