Date of Graduation


Document Type


Degree Name

Master of Science in Mechanical Engineering (MSME)

Degree Level



Mechanical Engineering


David Huitink

Committee Member

Millett, Paul

Second Committee Member

Song, Xiaoqing


Die attachmnet, Power electronics, Silver sintering


This master's thesis is dedicated to enhancing the reliability of silver sinter die attachments, a pivotal component within the dynamic realm of power electronics. The study is meticulously organized into four distinct chapters, each contributing to a comprehensive understanding of silver sinter die attachment reliability and its implications for contemporary electronic packaging. In Chapter 1, an introduction is provided to the significance of silver sinter die attachment in the context of power electronics, underlining the imperatives associated with miniaturization, weight reduction, and heightened efficiency. The compelling need to investigate die attachment properties, particularly in high-temperature and high-power-density environments, is emphasized. Chapter 2 delves into the intricate design and fabrication of an H-bridge module, offering a practical framework for examining the die attachment process. Chapter 3 undertakes a thorough analysis of the reliability of the silver sinter die attachment layer. Employing Finite Element Analysis (FEA) in Ansys, the behavior of the silver sinter die attachment layer under varying stress scenarios is modeled and comprehensively understood. This in-depth analysis includes a comparative exploration of temperature cycling and power cycling reliability tests, providing valuable insights into the die attachment's response under diverse operational conditions, encompassing the aspects of plasticity through the Anand viscoplasticity model and lifetime modeling. Lastly, in Chapter 4, pioneering research is introduced, aimed at enhancing the mechanical reliability of silver sinter die attachment. This novel approach explores the integration of copper nanowires into the substrate interface, offering a unique strategy to fortify the attachment's mechanical robustness and durability. This work addresses the burgeoning demand for a comprehensive investigation of die attachment reliability, especially in the face of rising power densities and temperatures in power electronics.

Available for download on Thursday, February 06, 2025