Describes a structure and process for packaging RF MEMS and other devices, employing a substrate of silicon and a cap of glass that have the cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are formed. The cap is attached to the substrate so as to enclose designated MEMS or other devices in the cavities. The substrate is then thinned so as to expose the metal of the vias at a lower surface of the substrate. Electrical connecting elements such as solder balls are then applied to the metal of the vias. The resultant composite substrate is then divided to provide individual packaged devices.
Electrical Engineering; Mechanical Engineering
Board of Trustees of the University of Arkansas (Fayetteville, AR)
Schaper, L. W., Malshe, A. P., & O'Neal, C. (2006). Method of packaging RF MEMS. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/120