Document Type

Patent

Publication Date

10-19-2004

Abstract

A capacitive structure is made with thin film capacitor plates substantially surrounding an opening cavity for accommodating a chip. The capacitive structure includes at least one capacitor and is mounted around the periphery of a ball grid array “BGA” having a flip chip in the opening. The capacitive structure provides a high capacitance with a low parasitic inductance.

Department

Electrical Engineering

Patent Number

US6806568

Application Number

US20030015783

Application Published

1-23-2003

Application Filed

7-20-2001

Assignee

Board of Trustees of the University of Arkansas (Little Rock, AR)

Comments

Leonard W. Schaper, Department of Electrical Engineering

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