Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods

Inventors

Leonard W. Schaper, University of Arkansas, FayettevilleFollow

Document Type

Patent

Publication Date

10-19-2004

Abstract

A capacitive structure is made with thin film capacitor plates substantially surrounding an opening cavity for accommodating a chip. The capacitive structure includes at least one capacitor and is mounted around the periphery of a ball grid array “BGA” having a flip chip in the opening. The capacitive structure provides a high capacitance with a low parasitic inductance.

Department

Electrical Engineering

Patent Number

US6806568

Application Number

US20030015783

Application Published

1-23-2003

Application Filed

7-20-2001

Assignee

Board of Trustees of the University of Arkansas (Little Rock, AR)

Comments

Leonard W. Schaper, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR

Citation

Schaper, L. W. (2004). Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/134