Date of Graduation
5-2015
Document Type
Thesis
Degree Name
Master of Science in Microelectronics-Photonics (MS)
Degree Level
Graduate
Department
Microelectronics-Photonics
Advisor/Mentor
Mantooth, H. Alan
Committee Member
Glover, Michael
Second Committee Member
Ang, Simon S.
Third Committee Member
Oliver, William III
Fourth Committee Member
Wise, Rick L.
Keywords
Applied sciences; Advanced electronic packaging; Advanced thin films; Ceramics; Extreme environment electronics; LTCC; Reliability of electronics
Abstract
As electronic components and systems become more intricate and expand into new realms of use case scenarios, new materials systems must be explored. With new systems comes the balancing acts of cost and reliability. Presented here is a thesis that explores a new hybrid-electronics packaging system using low temperature co-fired ceramics, referred to as LTCC. An LTCC system was designed to explore the environmental reliability of numerous thick film LTCC features and parameters. A key element was to explore how a thin film metallization stack up used to cap or seal underlying thick film structures would decrease environmental susceptibility while at the same time optimizing costs. A material matrix of 16 recipes was developed with 14 primary feature types to be evaluated. It was decided that the LTCC systems undergo five environmental reliability tests which were as follows: lifetime at elevated temperature, thermal cycling, humidity, thermal shock, and corrosion via salt fog spay. All environmental reliability tests were performed in accordance to either MIL or JEDEC standards or specifications. An investigation of occurring phenomena through each environmental test is presented.
Citation
Bourland, C. R. (2015). Environmental Reliability of Thin Film Sealing on Thick Film LTCC. Graduate Theses and Dissertations Retrieved from https://scholarworks.uark.edu/etd/1178
Included in
Electrical and Electronics Commons, Electronic Devices and Semiconductor Manufacturing Commons, Industrial Organization Commons