Date of Graduation

5-2015

Document Type

Thesis

Degree Name

Master of Science in Microelectronics-Photonics (MS)

Degree Level

Graduate

Department

Microelectronics-Photonics

Advisor/Mentor

Mantooth, H. Alan

Committee Member

Glover, Michael

Second Committee Member

Ang, Simon S.

Third Committee Member

Oliver, William F. III

Fourth Committee Member

Wise, Rick L.

Keywords

Applied sciences; Advanced electronic packaging; Advanced thin films; Ceramics; Extreme environment electronics; LTCC; Reliability of electronics

Abstract

As electronic components and systems become more intricate and expand into new realms of use case scenarios, new materials systems must be explored. With new systems comes the balancing acts of cost and reliability. Presented here is a thesis that explores a new hybrid-electronics packaging system using low temperature co-fired ceramics, referred to as LTCC. An LTCC system was designed to explore the environmental reliability of numerous thick film LTCC features and parameters. A key element was to explore how a thin film metallization stack up used to cap or seal underlying thick film structures would decrease environmental susceptibility while at the same time optimizing costs. A material matrix of 16 recipes was developed with 14 primary feature types to be evaluated. It was decided that the LTCC systems undergo five environmental reliability tests which were as follows: lifetime at elevated temperature, thermal cycling, humidity, thermal shock, and corrosion via salt fog spay. All environmental reliability tests were performed in accordance to either MIL or JEDEC standards or specifications. An investigation of occurring phenomena through each environmental test is presented.

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