A capacitive structure is made with thin film capacitor plates substantially surrounding an opening cavity for accommodating a chip. The capacitive structure includes at least one capacitor and is mounted around the periphery of a ball grid array “BGA” having a flip chip in the opening. The capacitive structure provides a high capacitance with a low parasitic inductance.
Board of Trustees of the University of Arkansas (Little Rock, AR)
Schaper, L. W. (2004). Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/134