Document Type
Patent
Publication Date
1-2-2001
Abstract
A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.
Department
Biological and Agricultural Engineering; Electrical Engineering; Mechanical Engineering
Patent Number
US6168744
Application Filed
10-8-1997
Assignee
Board of Trustees University of Arkansas (Little Rock, AR)
Citation
Malshe, A. P., Ozkan, A. M., & Brown, W. D. (2001). Process for sequential multi-beam laser processing of materials. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/174
COinS
Comments
Ajay P. Malshe, Department of Mechanical Engineering; Arzu M. Ozkan, Department of Biological and Agricultural Engineering; William D. Brown, Department of Electrical Engineering