A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.
Biological and Agricultural Engineering; Electrical Engineering; Mechanical Engineering
Board of Trustees University of Arkansas (Little Rock, AR)
Malshe, A. P., Ozkan, A. M., & Brown, W. D. (2001). Process for sequential multi-beam laser processing of materials. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/174