Document Type

Patent

Publication Date

1-2-2001

Abstract

A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.

Department

Biological and Agricultural Engineering; Electrical Engineering; Mechanical Engineering

Patent Number

US6168744

Application Filed

10-8-1997

Assignee

Board of Trustees of the University of Arkansas (Little Rock, AR)

Comments

Ajay P. Malshe, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR
Arzu M. Ozkan, Department of Biological and Agricultural Engineering, University of Arkansas, Fayetteville, AR
William D. Brown, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR

Share

COinS