Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.
Electrical Engineering; Mechanical Engineering
Board of Trustees of the University of Arkansas (Little Rock, AR)
Glezen, John H.; Naseem, Hameed A.; Brown, William D.; Schaper, Leonard W.; and Malshe, Ajay P., "Method of electroplating a substrate, and products made thereby" (1999). Patents Granted. 194.