Document Type
Patent
Publication Date
2-23-1999
Abstract
Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.
Department
Electrical Engineering; Mechanical Engineering
Patent Number
US5873992
Application Filed
3-24-1997
Assignee
Board of Trustees of the University of Arkansas (Little Rock, AR)
Citation
Glezen, J. H., Naseem, H. A., Brown, W. D., Schaper, L. W., & Malshe, A. P. (1999). Method of electroplating a substrate, and products made thereby. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/194
Comments
John H. Glezen, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
Hameed A. Naseem, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
William D. Brown, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
Leonard W. Schaper, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
Ajay P. Malshe, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR