Document Type
Patent
Publication Date
2-23-1999
Abstract
Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.
Department
Electrical Engineering; Mechanical Engineering
Patent Number
US5873992
Application Filed
3-24-1997
Assignee
Board of Trustees of the University of Arkansas (Little Rock, AR)
Recommended Citation
Glezen, John H.; Naseem, Hameed A.; Brown, William D.; Schaper, Leonard W.; and Malshe, Ajay P., "Method of electroplating a substrate, and products made thereby" (1999). Patents Granted. 194.
https://scholarworks.uark.edu/pat/194
Comments
John H. Glezen, Department of Electrical Engineering; Hameed A. Naseem, Department of Electrical Engineering; William D. Brown, Department of Electrical Engineering; Leonard W. Schaper, Department of Electrical Engineering; Ajay P. Malshe, Department of Mechanical Engineering