Document Type

Patent

Publication Date

2-23-1999

Abstract

Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.

Department

Electrical Engineering; Mechanical Engineering

Patent Number

US5873992

Application Filed

3-24-1997

Assignee

Board of Trustees of the University of Arkansas (Little Rock, AR)

Comments

John H. Glezen, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
Hameed A. Naseem, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
William D. Brown, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
Leonard W. Schaper, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
Ajay P. Malshe, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR

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