Describes an electrical interconnection medium having first and second interconnection layers, each interconnection layer including parallel conductors, the conductors of the first and second interconnection layers being oriented orthogonal to each other and being interconnected so as to form substantially interdigitated power distribution planes on each layer, each plane appearing on both layers. The interconnection medium advantageously is employed as a multichip module.
US5410107; EP0614220 (B1); DE69430829 (T2); JP3138383 (B2)
Board of Trustees of the University of Arkansas (Little Rock, AR)
Schaper, L. W. (1995). Multichip module and method of fabrication therefor. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/216