Document Type
Patent
Publication Date
12-5-1995
Abstract
A method of planarizing a diamond film which generally includes orifices in the surface is described. The method includes first polishing the diamond film surface to reduce the surface roughness. A filler material is applied to the surface of the film to fill the orifices in the film. The film is polished to remove excess filler material and expose the diamond film surface. Also disclosed are planarized diamond films diamond substrate having a polished surface of both diamond and filler material and a variation in thickness of less than 8 percent.
Department
Electrical Engineering; Mechanical Engineering
Patent Number
US5472370
Application Filed
7-29-1994
Assignee
University of Arkansas (Little Rock, AR)
Citation
Malshe, A. P., Brown, W. D., Naseem, H. A., & Schaper, L. W. (1995). Method of planarizing polycrystalline diamonds, planarized polycrystalline diamonds and products made therefrom. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/214
Comments
Ajay P. Malshe, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR
William D. Brown, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
Hameed A. Naseem, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR
Leonard W. Schaper, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR