Document Type
Patent
Publication Date
3-16-2004
Abstract
Describes surface applied passive devices for use on electronic circuit boards that are formed by applying layers of conductive, insulating, and other material to a thin polymer film carrier. The surface applied passives are thin enough to fit underneath standard integrated circuit packages in order to conserve space on the circuit board. Resistors, capacitors, inductors and other passive circuits may be formed on thin polymer films, less than 8 mils thick. This significantly aids in conserving space on an electronic circuit board.
Department
Electrical Engineering
Patent Number
US6707680
Application Number
US20020131254
Application Published
9-19-2002
Application Filed
3-5-2002
Assignee
Board of Trustees of the University of Arkansas (Little Rock, AR)
Citation
Schaper, L. W. (2004). Surface applied passives. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/142
Comments
Leonard W. Schaper, Department of Electrical Engineering, University of Arkansas, Fayetteville, AR