Document Type
Patent
Publication Date
3-1-2011
Abstract
A device having the capability for electrical, thermal, optical, and fluidic interconnections to various layers is described. Through-substrate vias in the interconnect device are filled to enable electrical and thermal connection or optionally hermetically sealed relative to other surfaces to enable fluidic or optical connection. Optionally, optical components may be placed within the region in order to manipulate optical signals. Redistribution of electrical interconnection is accomplished on both top and bottom surfaces of the substrate of the interconnect chip.
Department
Mechanical Engineering
Patent Number
US7897503
Application Number
US20090212407
Application Published
8-27-2009
Application Filed
5-12-2006
Assignee
Board of Trustees of the University of Arkansas (Little Rock, AR)
Citation
Foster, R. B., Malshe, A. P., & Kelley, M. W. (2011). Infinitely stackable interconnect device and method. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/74
Comments
Ajay P. Malshe, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR
Matthew W. Kelley, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR