Validating an Electronics Cooler Experiment and Optimizing Its Performance Using ANSYS Icepak

Author

Daniel V. Curl, University of Arkansas, FayettevilleFollow

Date of Graduation

5-2025

Document Type

Thesis

Degree Name

Bachelor of Science in Mechanical Engineering

Degree Level

Undergraduate

Department

Mechanical Engineering

Advisor/Mentor

Hu, Han

Committee Member

Chen, Yuxiang

Abstract

Researchers at the University of Arkansas' Mechanical and Electrical Engineering Research Departments have designed and built a cold plate and substrate design for a 10 kV SiC MOSFET power module. Many variables define the design of the cold plate and substrate system and have quantifiable effects on the device’s performance. These variables include but are not limited to geometry and material selection of the fins and substrate. Manufacturing many test designs, running experiments, and comparing their performance is a time-consuming and expensive design optimization method that may be effective for some low-cost applications. Still, simulation is often a more cost-effective optimization method for designs comprised of costly components. This project uses numerical modeling to model and simulate a digital twin of the cold plate-substrate system. Specifically, ANSYS Electronics Desktop Icepak was used. The conductivity of the complex substrate design will be modeled in CAD and simulated with an 80W digital MOSFET that mimics the thermal properties of a physical chip. Furthermore, the cold plate's ability to channel the heat out of the chip, into the fluid region, and out of the system will be modeled and tested across different flow rates (0.05 – 0.55 L/min). Experimental testing was compared to the mirror computational setup and indicated strong agreement for flow rates above 0.16 L/min, with deviations at lower flow rates being attributed to potential measurement inaccuracies or modeling limitations. Finally, design iterations were explored, including modifications to the outlet configuration, straight fins, and a slimmed design, to maximize cooling efficiency while reducing system weight, volume, and pressure drop.

Keywords

cold plate; ANSYS; 10kV; heat sink; simulation; validation

Citation

Curl, D. V. (2025). Validating an Electronics Cooler Experiment and Optimizing Its Performance Using ANSYS Icepak. Mechanical Engineering Undergraduate Honors Theses Retrieved from https://scholarworks.uark.edu/meeguht/135