Document Type
Patent
Publication Date
3-19-2024
Abstract
A microelectronic device and method of making the same including a substrate and at least one expansion layer that adds stress to the substrate when said substrate expands.
Department
Mechanical Engineering
Patent Number
US11935810
Application Number
US 20210265236
Application Published
8-26-2021
Application Filed
5-6-2021
Assignee
Board of Trustees of the University of Arkansas (Little Rock, AR)
Citation
Huitink, D., & Harris, J. (2024). Chip Warpage Reduction Via Raised Free Bending And Re-entrant (auxetic) Trace Geometries. Patents Granted. Retrieved from https://scholarworks.uark.edu/pat/477
COinS
Comments
David Huitink, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR
John Harris, Department of Mechanical Engineering, University of Arkansas, Fayetteville, AR