Date of Graduation
5-2009
Document Type
Thesis
Degree Name
Bachelor of Science in Computer Engineering
Degree Level
Undergraduate
Department
Computer Science and Computer Engineering
Advisor/Mentor
Deaton, Russell J.
Committee Member/Reader
Parkerson, James Patrick
Committee Member/Second Reader
Kim, Jin-Woo
Abstract
Self-assembly is the process of constructing a larger structure from small component parts that randomly collide and bond through weak interactions [2]. It is a potentially important method in the field of nanoscale manufacturing. However, because of the nature of self-assembly, randomness and the design of self-assembly compete with each other, and unforeseen things can be produced. In this thesis, the tiling assembly model of Winfree [7] was simulated. The tiling assembly model has two bonds which assemble planar nanostructures. The goal of the simulations was to determine what probabilities would produce an average degree of four (the ideal) for each node in the structure. It was found that large differences in bond formation probabilities tended to produce structures with higher average degree, in accordance with the theory of [1], but also that large probabilities in general did the same thing. In addition, the simulations did not produce degrees of four because the simulations did not impose sufficient geometric constraints upon bond formation.
Citation
Dasgupta, A. (2009). Understanding sources and consequences of variation in self-assembly. Computer Science and Computer Engineering Undergraduate Honors Theses Retrieved from https://scholarworks.uark.edu/csceuht/23