Date of Graduation
5-2019
Document Type
Thesis
Degree Name
Bachelor of Science in Electrical Engineering
Degree Level
Undergraduate
Department
Electrical Engineering
Advisor/Mentor
Mantooth, H. Alan
Abstract
PowerSynth is a software platform that can co-optimize power modules utilizing a 2D topology and wire bond interconnects. The novel 3D architectures being proposed at the University of Arkansas utilize solder ball interconnects instead of wire bonds. Therefore, they currently cannot be optimized using PowerSynth. This paper examines methods to accurately model the parasitic inductance of solder balls and ball grid arrays so they may be implemented into software for optimization. Proposed mathematical models are validated against ANSYS Electromagnetics Suite simulations. A comparison of the simulated data shows that mathematical models are well suited for implementation into optimization software platforms. Experimental measurements proved to be inconclusive and necessitate future work.
Keywords
solder ball array interconnects power module
Citation
Swearingen, P. (2019). Modeling Solder Ball Array Interconnects for Power Module Optimization. Electrical Engineering Undergraduate Honors Theses Retrieved from https://scholarworks.uark.edu/eleguht/65
