Document Type

Article

Publication Date

1-20-2025

Keywords

Peeling Behavior, Placement, Composites, Shearing, Surface, Film

Abstract

Advancements in additive manufacturing and robotic automation have enabled diverse fabrication techniques using various materials. However, small-scale tape placement for three-dimensional (3D) printing remains underexplored, with most research focused on large-scale composite manufacturing using carbon fiber prepreg tapes. This work presents an innovative, automated, and cost-effective tape placement system that extends traditional methods beyond carbon fiber prepreg. We developed a customized tape print module (TPM) integrated with a robotic arm, enabling precise and versatile tape placements. Our system supports non-linear toolpaths, complex patterns, and controllable placements on multi-plane surfaces, creating overhangs without support. We demonstrate circuit printing with copper tape for high-current applications and 3D structure printing through layer-by-layer placement. Our research highlights the system's potential for electronic applications, such as circuits and tactile sensor fabrication. This approach democratizes advanced tape placement, offering new possibilities for 3D printing, sensor fabrication, and packaging, particularly for researchers and small-scale manufacturers.

Comments

Web of Science

Elsevier

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